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Laser Micro Processing |
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| Manufacturer,
Supplier and Exporter of Laser Metal Cutting Machines... |
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Wafer Laser Dicing System
Wafer Laser Dicing System researched by HGLaser is with internationl advanced lever.It is adopted with UV cold laser source, with small heat affected zone and fine scribing quality. Non-contact processing which avoids stress generates during processing can increase the cutting quality and efficiency of the crystalline grain.After processing, the chip will have good electrical performance. This system which is integrated with manual cutting system and CCD graph processing system can acheive manual cutting or auto cutting.
Highlights
•Advanced hardware control technology and intelligent software
•High laser beam quality, small focus, long service lifetime of laser
•Auto graph identifing and positioning function
•High precision 2 dimension moving working table, high accuracy rotary working table
•High reliabity, high stability and high security
•After cutting, the crystalline grain with high quality and high yield
•Key panel controlling,easy operation.
Parameters
| Model |
LDU6 |
| Wavelength |
Short Wavelength purple Laser |
| Max.Journey area |
250300 Random rotation angle of axle |
| Max.Processing area |
4 inches |
| Positioning accuracy |
0.004mm |
| Repeatability |
0.002mm |
| Rotary accuracy |
0.001degree |
| Min.spot diameter |
0.020mm |
| Cutting depth |
0-0.5mm |
| Cutting Speed |
0~80mm/s |
| Cutting line width |
0.02~0.06mm |
| Laser generator |
Q switch solid diode pulse purple laser |
| Power |
220V AC 10%50-60Hz |
| Supply pressure range |
0.5~0.8Mpa(5.0~8.0kgf/cm2) |
| Dimensions |
Main machine(LWH):10508801600mm
Coolling system(LWH):440533264mm
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| Working environment demands |
Temperature 15-35C
Relative humidity10%-80%, no condensation |
| Others |
Without corrosive gas or liquid, strong maagnetic field and strong electric field. |
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LED Wafer Laser Scribing Machine
This kind of cutting system is adapted to cut extension patch of LED sapphire underlay. Products have advantage of high precison of location¡¢small focus facula¡¢adopting CCD coaxial stakeout,which can satisfy cutting technical requirment of patch of LED sapphire underlay.
Highlights
•High precision linear moving platform
•Marble foundation bed bear the weight of working table
•Focus tunable framework
•Include CCD location system
•CCD coaxial stakeout
•High reliablity,easy operation
•low maintenance cost and running cost
Parameters
| Laser wavelength |
355nm |
| Laser power |
1.5W@100KHz |
| Accuracy of X,Y axeses |
0.5um |
| Accuracy of Z axes |
0.5um |
| Accuracy of :È axes |
0.0005Degree |
| CCD location accuracy |
1um |
| Location accuracy |
1um |
| Reptition location accuracy |
0.5um |
| Effective route of working tables |
150mmX150mm |
| Max cutting dimension |
3inch |
| Cutting line width |
6-8um |
| Cutting depth |
20~30um |
| Cutting speed |
25~55mm/s |
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ITO Film Laser Etching Machine
ITO film laser etching machine is precision equipment of electrode etching the ITO Glase and ITO Film by laser.It can be used to processing and etching various kinds of patterns in glass¡¢ITO Film of PET floor¡¢polycrystal film and other oxide film,especially adapt to touch screen of mobile phone
Highlights
•High repeatability and power
•High speed material removal rate
•No environment pollution from chemistry rusty
•High precision two-dimension moving platform, high speed galvanometer system
Parameters
| Model |
LSF20D |
| Average output power |
20w |
| Laser wavelength |
1064nm |
| Marking area |
110mmX110mm |
| Working table route |
400mmX400mm |
| Min. line width |
0.01mm |
| Power |
AC220v 50KHZ |
| Compress air |
0.4-0.6MPa |
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Laser Trimming Machine
Laser trimming system is the key equipment which is applied for engraving thin or thick film resistor to get precise regulation. It can be used to regulate thin or thick membrane resistance of electric appliance such as power supply, sensor, and thick or thin film circuit automatically and precisely.
•System Composition
•Laser system
•Q-switch system
•Optics system
•Galvo scanning system
•Computer controling system
•Cooling system
•Visual identifying system (Optional)
•Multi-station worktable (Optional)
•Coaxial monitoring system (Optional)
•Programmable power supply and programmable load
Highlights
•It is featured of high precision resistance regulation, high scanning speed and reliable performance;
•It can work continuously for long time;
•The whole processing procedure can be finished automatically or manually according to the actual application, it is very convenient and reliable;
•Coaxial monitoring system is optional for real time monitoring of resistance regulation process;
•High isolated test of resistance;
•Automatic output voltage and current measuring according to different application.
Parameters
| Laser Type |
Diode end-pumped laser/diode side-pumped laser(optional) |
| Laser wavelength |
532nm/1064nm |
| Frequency |
1~20KHz |
| Operation Style |
Scanning, automatic/manual |
| Resistance measuring accuracy |
0.05% |
| Resistance regulating range |
1~10M |
| Power Supply |
Single phase 220V10% 50Hz 20A |
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| One
of the leading Manufacturer, Supplier, Exporter of Laser
Cutting Machines like Laser Scribing
Film Machine, Die Board Laser Cutting
Machine, Laser Engraver Machine, Laser
Marker Machine from New Delhi, India. |
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